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- Jetson AGX Orin H01 Kit with powerful Jetson AGX Orin 32GB Module
- Delivers up to 200 TOPs AI performance for advanced AI applications
- Rich connectivity: PCIe X16, GbE, 10GbE, 3 × USB 3.2, HDMI 2.1
- Multiple expansion options: M.2 Key M, M.2 Key E, 16-lane MIPI CSI-2, 40Pin header
- Pre-installed with JetPack 5.1.2 for easy AI development
- Ideal AI development kit for robotics, autonomous machines, and edge computing
Jetson AGX Orin H01 Developer Kit with Jetson AGX Orin 32GB Module - Seeed Studio
The Jetson AGX Orin H01 Developer Kit with Jetson AGX Orin 32GB Module by Seeed Studio is a high-performance AI development kit designed for advanced robotics, autonomous machines, and edge computing solutions.
Powered by the Jetson AGX Orin 32GB Module, this development kit delivers an impressive 200 TOPs of AI performance, enabling demanding AI workloads with ease.
It offers a wide range of rich interfaces such as PCIe X16, Gigabit Ethernet, 10GbE, USB 3.2, HDMI 2.1, M.2 Key M and E slots, a 16-lane MIPI CSI-2, and a 40Pin header to support flexible expansion and connectivity.
Pre-installed with JetPack 5.1.2, the Jetson AGX Orin H01 Kit provides developers with a ready-to-use platform for efficient development and rapid prototyping of AI-powered applications.
Features:
- Brilliant AI Performance for Production: on-device processing with up to 200 TOPS AI performance at low power and latency, providing up to 10X the performance of Jetson Xavier NX and up to 6X the performance of Jetson AGX Xavier.
- The hand-size edge AI device is 107mm x 106.4mm x 70.5mm and includes the Jetson AGX Orin™ production module, a heatsink with a cooling fan, an enclosure, and a power connector.
- PCIe X16, GbE, 10GbE, 3x USB 3.2, HDMI 2.1, M.2 Key M, M.2 Key E, 2.4/5GHz Wi-Fi, Bluetooth, 16 lane MIPI CSI-2, 40-pin header.
- Pre-installed JetPack 5.1.2, Linux OS BSP, support for Jetson applications, and major AI frameworks and software platforms all help to accelerate solution delivery.
Hardware Overview:
Top View:

Bottom View:

Important Upgrades:
- Upgrade the A605 carrier board to version 2.3 on November 25, 2024. There are a few adjustments.
- To address the issue of device reboot caused by using some USB devices with high dynamic current, the 5V power supply solution was altered (the power IC was replaced with a TI TPS5301DGS).
- Optimized PCB layout.
- The Wi-Fi module was replaced with the BL-M8822CP1, and the software driver was updated concurrently.
Applications:
- Traffic Management:
- License plate detection
- Car detection
- Pedestrian detection
- Industry 4.0:
- Helmet detection
- Hard hat detection
- Custom PPE detection
- Visual Anomaly Detection
- Retail:
- Sentiment analysis
- Retail store items detection
- Robotics:
- Under-ice sensing ROV
- Warehouse towing robot
- Edge AI into the Wild:
- Wildfire detection
- Agriculture:
- Weeding machines
- Tractors
- Livestock detection
- Healthcare:
- Medical imaging analysis
Shipping & Returns
Shipping & Returns
- All orders confirmed before 3 pm IST are shipped on the
same day, barring rare pickup delays on holidays or disturbances - Delivery time in Metro cities is 1-3 days, Others it is
3-7 days. It varies based on location, reliant on courier services - Return window: 7 days from receipt unless stated
otherwise. No refunds/replacements after - Returns only for non-working/damaged products are accepted
- Initiate return requests to our customer service team via Support ticket or contact us at +91-8123057137
- Refunds are processed within 3-4 working days post inspection and approval.
For more details, please check our Shipping and Return Policy
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Package Includes:
- 1 x Jetson AGX Orin H01 Developer Kit with Jetson AGX Orin 32GB Module - Seeed Studio
Specifications:
Specifications | Jetson AGX Orin 32GB H01 Kit |
---|---|
AI Performance | 200 TOPS |
GPU | 1792-core NVIDIA Ampere GPU with 56 Tensor Cores |
CPU | 8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3 |
Memory | 32 GB 256-bit LPDDR5, 204.8 GB/s |
DL Accelerator | 2 x NVDLA v2.0 |
Vision Accelerator | 1 x PVA v2.0 |
Storage | 64GB eMMC 5.1 |
Video Encoder |
1x 4K60 / 3x 4K30 / 6x 1080p60 / 12x 1080p30 (H.265) 1x 4K60 / 2x 4K30 / 5x 1080p60 / 11x 1080p30 (H.264) |
Video Decoder |
1x 8K30 / 2x 4K60 / 4x 4K30 / 9x 1080p60 / 18x 1080p30 (H.265) 1x 4K60 / 2x 4K30 / 5x 1080p60 / 11x 1080p30 (H.264) |
Display Output | 1 × HDMI 2.1 |
Camera Interface | 1 × 16-lane MIPI CSI-2 connector |
Networking | 1 × GbE 1 × 10GbE |
USB Ports | 2 × USB 3.2 Type-A (Integrated USB 2.0) 1 × USB 3.2 Type-C (Integrated USB 2.0) |
M.2 Key M | 1 × M.2 Key M |
M.2 Key E | 1 × M.2 Key E (pre-installed WIFI+BT: BL-M8822CP1) |
Fan Connector | 1 × 4-pin fan (5V PWM) |
microSD Card Slot | 1 × microSD card slot |
Audio Jack | 1 × 3.5mm audio jack |
RTC | 2-pin RTC |
RS485 | 1 × RS485 (3P 1.5mm pitch) |
RS232 | 1 × RS232 (3P 1.5mm pitch) |
Other Interfaces |
40-pin header, 1 × SPI Bus (+3.3V Level), 6 × GPIO (+3.3V Level), 1 × CAN, Force Recovery, Reset and Power ON/OFF buttons, 12V/2A 2-pin power output |
Power Supply | 9–20V DC Input @ 8A |
Mechanical Dimensions | 107mm × 106.4mm × 70.5mm |
Operating Temperature | -25°C to +70°C |